The JAI Sweep+ SW-4010Q-MCL is a prism-based industrial line scan camera with four image sensors. The camera allows for simultaneous collection of red, green and blue image data on three separate CMOS sensors, plus a fourth sensor that collects image data from the Short Wave InfraRed (SWIR) spectrum using a sensor based on indium gallium arsenide (InGaAs) technology.
The SW-4010Q-MCL’s prism technology aligns all four sensors to the same optical plane so that red, green, blue, and SWIR image data can all be captured in a single pass with precise pixel-level correlation and no parallax issues. This results in machine vision systems with lower set-up complexity and lower hardware costs.
The camera’s three CMOS sensors provide complete coverage of the visible spectrum from 400 nm to 700 nm, while the InGaAs sensor captures light waves ranging from approximately 800 nm to 1700 nm. This enables precise color inspection of surface features while also looking beneath the surface for additional “hidden” image data.
Built-in scaling, ROI, and binning functions let users easily align the line rate and field-of-view between visible and SWIR channels while setting RGB pixel resolution to be the same as the SWIR channel, twice the SWIR channel, or a custom resolution factor.
4-Bands R-G-B + SWIR
4096 x 1 px / 1024 x 1 px
Mini Camera Link
3x CMOS + 1x InGaAs
30.72 mm / 25.6 mm
7.5 x 7.5 µm / 25.0 x 25.0 µm
30.8 mm / 25.6 mm
90 x 90 x 120 mm
-5°C to +45°C
Sweep+ line scan cameras are the ideal choice if you have machine vision systems needing inspection in both the visible and SWIR light wave range.
Fruit and vegetable inspection that simultaneously looks at colors, ripeness, damages, signs of rot under skin, as well as detecting foreign objects (e.g. stones, metal pieces etc.).
The color, size, shape and damage of nuts and almonds can be inspected using a visible channel, while foreign objects (including olive pits) are more clearly seen with the SWIR channel.
Inspection systems in the semiconductor industry can be used to find defects on the surface and below the surface of silicon wafers, as those materials have a high spectral transmittance in the SWIR waveband.
Inspect the finished package on the outside (looking at the color printing and package completeness) and at the same time look through opaque plastic packages and containers to check for correct amount of content or fill levels.
The combined R-G-B and SWIR inspection is ideal for checking pharmaceutical packaging as well as currency inspection looking at color correctness, watermarks and security features woven into the bank notes.
Flawless batteries are critical for safety, energy density and to prevent early degradation. Line scan cameras can be used to check for defects such as scratches, dents, craters, inclusions, bubbles, and holes on electrode sheets.
Precision agriculture or intelligent farming has seen an exponential growth in the recent years. Removal of weeds/ wild plants or precision crop harvesting is of growing importance in intelligent farming and R-G-B- SWIR multi-spectral cameras are playing a vital role.
Other applications include various web inspection tasks in connection with the manufacturing of items such as color tiles and textiles (checking if dyed textile is dry enough for further processing).
Surface inspection of flat panels/displays inspecting color correctness and looking for defective screen pixels, scratches, or other defects.
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