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WAA-1300-GE-TEC

Wave Series
WAA-1300-GE-TEC
High-performance InGaAs Visible + SWIR area scan camera

The WAA-1300-GE-TEC is a high-performance industrial Visible + SWIR area scan camera that combines spectral sensitivity from 400 nm to 1700 nm with 1.3 MP resolution and frame rates of up to 90 fps. Integrated ThermoElectric Cooling (TEC) minimizes sensor noise and maintains temperature stability for consistent, high-quality imaging.

Product Image WAA 1300 GE TEC Direct front

Product Image WAA 1300 GE TEC 45 degree front

Product Image WAA 1300 GE TEC 45 degree back angle

Product Image WAA1300 GE TEC Direct back view

Equipped with ThermoElectric Cooling (TEC) Solution

The integrated TEC solution actively cools the sensor and maintains a stable operating temperature over time. This reduces dark noise, improves signal-to-noise ratio, and helps keep calibration data reliable for consistent, high-quality imaging performance.

Efficient data transfer with GigE Vision interface

Stable and efficient data transfer is achieved via a GigE Vision interface, ensuring reliable performance for high-speed imaging while simplifying system integration and eliminating the need for costly, machine-vision–specific frame grabber cards.

Visible + SWIR wide waveband

A wide spectral response from 400 to approximately 1700 nm enables the camera to capture both visible and short-wave infrared information, enabling enhanced material contrast and broader application coverage while reducing system complexity.

Features
Specifications
Downloads
Accessories

Features

1.3-megapixel resolution with 5 µm square pixels
1280 x 1024 pixel output at up to 90 fps
Visible + SWIR InGaAs image sensor (400–1800 nm spectral response)
Selectable output formats (Mono8/10/12-bit)
Supports binning and image flip
Region-of- Interest (ROI). Allows image capture using selected sections of the sensor line
Integrated thermoelectric cooling (TEC)
Image uniformity and correction: Flat-field correction (FFC), defective pixel correction (DPC), black level and gamma control
Image tuning and enhancement: Brightness and contrast control, temporal & spatial denoise, enhancement control, LUT
Gain control from 0dB to 42dB
Standard C-mount

Specifications

Product Line

Wave Series

Model

WAA-1300-GE-TEC

Type

Area Scan

Color / Mono

Mono

Light Spectrum

SWIR

Resolution

1.3 MP

Resolution WxH

1280 x 1024 px

Frame rate / Line rate

90 fps

ROI

Yes

Interface

GigE Vision

Sensors

1xInGaAs

Sensor Name

IMX990

Optical Format

1/2 inch

Cell Size WxH

5.0 x 5.0 µm

Shutter type

Global shutter

Sensor Diagonal

8.2 mm

Active Sensor Dimensions WxH

5.12 x 6.4mm

Camera Dimensions HxWxL

60.0 x 60.0 x 80.5

Weight

400 g

Video Output

8/10/12-bit

Lens Mount

C-mount

Power Consumption

6.5 Watt

Operating Temperature (ambient)

-20°C to +55°C

Downloads

Manual & datasheet

Power supply unit with 12-pin connector cable

Power supply unit with 12-pin female connector cable - without power cord.
(LKK-PSU-12PF-1.25)

Hirose equivalent connector with cable length of 1.25 meters.

Item number - Power Supply:

31017431: PSU 12-pin 1.25m LKK-PSU-12PF-1.25 (1.25 meter cable length)

Download datasheet

If you plan to include a power supply when ordering our cameras, please remember to also order the appropriate power cord for the power supply.
(Power cords are sold separately from the power supply).

Item numbers - Power Cords:

31017432 (US/Japan): CordPSUTypeA(USJP)1.2m LKK-PSU-PWR-A-1.2 (1.2 meter cable lenght).

31017433 (China): CordPSUTypeI(CN) 1.2m LKK-PSU-PWR-I-1.2 (1.2 meter cable lenght).

31017434 (Europe/Korea): CordPSUTypeC(Euro) 1.5m LKK-PSU-PWR-C-1.5 (1.5 meter cable lenght).

Note: Power supply item and power cords item can ONLY be order in connection with the camera (Not available for stand alone orders).

Typical applications

WAA-1300-GE-TEC scan camera is a perfect fit for a wide range of machine vision applications

Fruit and Vegetable Sorting and Grading

Visible + SWIR imaging enables detection of bruising, moisture variations, ripeness levels, early spoilage, and subtle material differences. It also supports grading based on size and surface quality, as well as inspection of packaged food, including caps and seals.

Semiconductor alignment

In semiconductor manufacturing, SWIR imaging reveals alignment marks beneath silicon layers without removing or altering the wafer structure. This enables precise alignment of successive process layers, while the cooled sensor provides the sensitivity and image quality required for reliable detection and high-accuracy measurements.

Plastic seal inspection

Enhanced contrast in transparent and semi-transparent materials allows reliable detection and measurement of heat seals that are difficult to evaluate using visible-light imaging. This supports accurate verification of seal quality and consistency while helping identify defects that could compromise package integrity.

Laser beam profiling

Accurate measurement of beam shape, intensity distribution, and alignment is made possible through SWIR area scan imaging. The technology also supports beam stability monitoring and safe characterization of high-power and process lasers that cannot be reliably measured with conventional visible-light cameras.

Recycling and material sorting

SWIR imaging supports reliable verification of material classification after sorting while enabling evaluation of new materials and sorting criteria before full-scale deployment. It is particularly effective for inspecting larger or irregularly shaped objects where motion control may be limited or inconsistent.

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